Tuesday, 5 July 2016

Foxconn IPO

July 6th, Foxconn Interconnect Technology Limited submitted IPO application to HKSE. According to informed sources, this IPO is to raise USD500 million to USD1 billion. 7月6日消息,据国外媒体报道,台湾鸿海精密(即富士康)旗下鸿腾精密科技股份有限公司(Foxconn Interconnect Technology Limited, 以下简称“鸿腾精密”)已在香港提交首次公开招股(IPO)申请。消息人士透露,这次IPO可能融资5亿美元至10亿美元。

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